Occam Process: Assembly without Solder

Have you heard of assembly without solder? In this episode, Joseph (Joe) Fjelstad, founder and president of Verdant Electronics, talks about the Occam process. 
Let’s hear about Joe’s 50 years of experience in the electronics industry and how he got started with solderless assembly for electronics.
Altium 365: Where the World Designs Electronics
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Show Highlights:
Joe talks about his background and previous roles in the industry, including his position as the educational director in the IPC and Kurchatov Institute of Atomic Research in the Soviet Union
“Assembly without solder” Joe recollects how he arrived at the idea of a better way to build electronics – build a component board and put circuits on it.
Joe shares how he came up with the Occam process and its benefits “It absolutely doesn't need to be for everything, but it can be for a lot of things, and it can make products that will be at once cheaper, better performing, lighter, more environmentally friendly.”
Download Joe’s book for free: Solderless Assembly for Electronics: The SAFE Approach
More about the Occam Process
Did Joe coin “Design with Manufacturing”? He shares his efforts in promoting solid work relationships between PCB designers and manufacturer
Occam Process vs. 3D printing, could 3D printing bypass solderless assembly? Read Joe’s article Putting 3D interconnection technologies into perspective from chip to system
Joe commended the microvia technology, “they know how to build these things”

Links and Resources:
Connect with Joseph Fjelstad on LinkedIn
Visit Verdant Electronics website
Read Joe Fjelstad Interview: Breaks Down His Occam Process
Download Joe’s book for free: Solderless Assembly for Electronics: The SAFE Approach
Connect with Zach on LinkedIn

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