Cutting Edge Technology in Packaging with an Interposer

In this episode, our guest Joe Dickson, tells us about the cutting-edge technology implemented in advanced packaging at Wus Printed Circuit International.  
Watch the episode here
Show Highlights:
Joe Dickson talks about what they do at Wus, a printed circuit manufacturing company
He shares about their efforts to bring PCB technologies farther up by introducing advanced packaging options
He briefly describes what printed circuit-like materials are, also known as the vertical interposers or PCIe


Zach explains how a pre-packaged chip can be mounted on a board
What are the reliability and signal integrity challenges that come with assembling different packages on a board
Off-the-board solutions start to become more and more desirable 


The flexibility of design and components is what driving the market to use more integrated packaging
Speed is everything! When will the industry move on from copper and go to optical? 
Knowing what's going on in simulations is very important; it opens opportunities to try new things
Joe explains a way of using Faraday cages with cable connections on the surface
Examples of the large market using the PCIe method are Xilinx and NVIDIA
How far is silicon photonics from becoming mainstream as an interconnect technology?
Standardazion versus innovation
The future of PCB assembly is hybrid. Some will use the off-shelf, best-in-class products from Intel, AMB, NVIDIA, Xilinx, and get creative with them. 

Links and Resources:
Connect with Joe Dickson on LinkedIn
Visit Wus Printed Circuit International website
Watch the related episode:
Eliminating Nuances in the PCB Manufacturing Processes with Amit Bahl of Sierra Circuits PCB


Connect with Zach on LinkedIn
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